Global Semiconductor Advanced Packaging Market Forcast To Grow At CAGR Of 8.45% Between 2017-2021
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Semiconductor Advanced Packaging Market 2017-2021 provides
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About
Semiconductor
Advanced Packaging Market
Semiconductor packaging is carried
out to provide protection to the wafer or substrate. The casing
(package) is built from materials such as plastic, metal, glass, or
ceramic and contains one or more semiconductor electronic components.
Semiconductor advanced packaging is a key component of the
semiconductor manufacturing process. The package of a semiconductor
device is usually made of materials such as plastic, metal,
ceramic/glass. Packaging is undertaken to provide protection against
impact and corrosion. It also has contact pins or leads used to
connect external circuits to the device; the package also dissipates
the heat produced in the device. Some of the advanced packaging
technologies used in semiconductor device packaging are fan-out
wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level
packaging (FI WLP), and 2.5D/3D.
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Technavios analysts forecast the
global semiconductor advanced packaging market to grow at a CAGR of
8.45% during the period 2017-2021.
Covered in this report
The report covers the present
scenario and the growth prospects of the global semiconductor
advanced packaging market for 2017-2021. To calculate the market
size, the report considers the sale of semiconductor capital
equipment to end-use segments.
The market is divided into the
following segments based on geography:
Americas
APAC
EMEA
Technavios report, Global
Semiconductor Advanced Packaging Market 2017-2021, has been prepared
based on an in-depth market analysis with inputs from industry
experts. The report covers the market landscape and its growth
prospects over the coming years. The report also includes a
discussion of the key vendors operating in this market.
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Report @
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Key vendors
Advanced Semiconductor Engineering
(ASE)
Amkor Technology
Samsung Semiconductor (SAMSUNG)
TSMC (Taiwan Semiconductor
Manufacturing Company)
Other prominent vendors
China Wafer Level CSP
ChipMOS TECHNOLOGIES
FlipChip International
HANA Micron
Interconnect Systems (Molex)
Jiangsu Changjiang Electronics
Technology (JCET)
King Yuan Electronics
Tongfu
Microelectronics
Nepes
Powertech Technology (PTI)
SIGNETICS
Tianshui Huatian
Ultratech
UTAC
Market driver
Complex semiconductor IC designs
For a full, detailed list, view
our report
Market challenge
Rapid technological changes
For a full, detailed list, view
our report
Market trend
Changes in wafer size
For a full, detailed list, view
our report
Key questions answered in this
report
What will the market size be in
2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market
growth?
Who are the key vendors in this
market space?
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Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
Market outline
Semiconductor value chain
PART 05: Technology landscape
Back-end chip formation
Wafer-level vs die-level packaging
Roadmap of semiconductor packaging
industry
Ecosystem of semiconductor IC
packaging industry
PART 06: Market landscape
Market overview
Market size and forecast
Five forces analysis
PART 07: Segmentation by packaging
technology
Global semiconductor advanced
packaging market by technology
Flip-chip packaging
FI WLP
2.5D/3D packaging
FO WLP
PART 08: Segmentation by device
type
Global semiconductor advanced
packaging market by device type
Analog and mixed ICs
MEMS and sensors
Logic and memory devices
Wireless connectivity devices
CMOS image sensors
PART 09: Geographical segmentation
Global semiconductor advanced
packaging market by region
APAC
Americas
EMEA
PART 10: Decision framework
PART 11: Drivers and challenges
Market drivers
Market challenges
PART 12: Market trends
Changes in wafer size
Integration of semiconductor
components in vehicles
Increase in number of M&A
Short product lifecycle of mobile
devices
Increase in number of OSAT vendors
High need for semiconductor memory
devices
Growing acceptance of wearable
devices
PART 13: Vendor landscape
Competitive scenario
Leading vendors
Other prominent vendors
PART 14: Appendix
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