Global Plating for Microelectronics Market by Manufacturers, Countries, Type and Application, Forecast to 2023
"The Report North America
Plating for Microelectronics Market by Manufacturers, Countries, Type
and Application, Forecast to 2023 provides information on pricing,
market analysis, shares, forecast, and company profiles for key
industry participants. - MarketResearchReports.biz"
About
Plating
for Microelectronics Market
Metal plating (also known as
electroplating or electrodeposition) is a coating technology that
deposits a thin later of a metal or alloy on a conductive surface to
impart particular functional or aesthetic properties. During the
plating process, the object to be plated functions as the positively
charged cathode while the desired plating material serves as the
negatively charged anode and source of the metallic ions that will
form the final coating. Immersing both materials in a bath or
solution of electrolyte salts and adding an electrical current causes
an oxidation/reduction reaction on the surface of the cathode where
the metallic ions are deposited.
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Scope of the Report:
This report focuses on the Plating
for Microelectronics in North America market, especially in United
States, Canada and Mexico. This report categorizes the market based
on manufacturers, countries, type and application.
Market Segment by Manufacturers,
this report covers
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
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Market Segment by Countries,
covering
Electroplating
Electroless
Immersion
Market Segment by Type, covers
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Market Segment by Applications,
can be divided into
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
There are 15 Chapters to deeply
display the North America Plating for Microelectronics market.
Chapter 1, to describe Plating for
Microelectronics Introduction, product type and application, market
overview, market analysis by countries, market opportunities, market
risk, market driving force;
Chapter 2, to analyze the
manufacturers of Plating for Microelectronics, with profile, main
business, news, sales, price, revenue and market share in 2016 and
2017;
Chapter
3, to display the competitive situation among the top manufacturers,
with profile, main business, news, sales, price, revenue and market
share
in 2016 and 2017;
Chapter 4, to show the North
America market by countries, covering United States, Canada and
Mexico, with sales, revenue and market share of Plating for
Microelectronics, for each country, from 2013 to 2018;
Chapter 5 and 6, to show the
market by type and application, with sales, price, revenue, market
share and growth rate by type, application, from 2013 to 2018;
Chapter 7, 8 and 9, to analyze the
segment market in United States, Canada and Mexico, by manufacturers,
type and application, with sales, price, revenue and market share by
manufacturers, types and applications;
Chapter 10, Plating for
Microelectronics market forecast, by countries, type and application,
with sales, price and revenue, from 2018 to 2023;
Chapter 11, to analyze the
manufacturing cost, key raw materials and manufacturing process etc.
Chapter 12, to analyze the
industrial chain, sourcing strategy and downstream end users
(buyers);
Chapter 13, to describe sales
channel, distributors, traders, dealers etc.
Chapter 14 and 15, to describe
Plating for Microelectronics Research Findings and Conclusion,
Appendix, methodology and data source
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Albany, NY 12207
Tel: +1-518-621-2074
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